Books by author John Lau

Showing 1 – 7 out of 7 results

1. 

   Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

   John Lau, Xuejun Fan | Springer, Berlin, 2025

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   181.50 €

   Sale 9 %

   You save 19.49 €

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2. 

   3D IC Integration and Packaging

   John Lau | McGraw-Hill Education - Europe, 2015

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   218.09 €

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3. 

   Through-Silicon Vias for 3D Integration

   John Lau | McGraw-Hill Education - Europe, 2012

   
   

   In stock at our supplier - Shipping in 9 - 15 days

   Language: English

   Binding: Hardback

   179.37 €

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4. 

   Basics Fashi Desi 09 Designi Acesories

   John Lau | AVA, 2013

   
   

   50/50 - We search the world

   Language: English

   Binding: Paperback

   30.90 €

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5. 

   Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

   John Lau, Kuo-Ning Chiang | Springer, Berlin, 2026

   
   

   Low in stock at our supplier - Shipping in 11 - 15 days

   Language: English

   Binding: Hardback

   216.77 €

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6. 

   Thermal Stress and Strain in Microelectronics Packaging

   John Lau | Springer-Verlag New York Inc., 2012

   
   

   In stock at our supplier - Shipping in 5 - 8 days

   Language: English

   Binding: Paperback

   154.64 €

   Sale 7 %

   You save 12.89 €

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7. 

   Reliability of RoHS-Compliant 2D and 3D IC Interconnects

   John Lau | McGraw-Hill Education - Europe, 2010

   
   

   In stock at our supplier - Shipping in 9 - 15 days

   Language: English

   Binding: Hardback

   139.75 €

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